MAX PCB: L 510 x W 590MM
Mounting Speed: 84,000 CPH
Application components: 0402 (01005)
Inpus feeder: Max. 68
Panasonic NPM-D3 pick and place machine
Specifications:
Plus new enhancements:
Compact footprint - scale production to your factory needs
Quick-change feeder carts, nozzle banks, and process heads
Compatible with CM- & AM-series intelligent feeders & nozzles
Board warp detection, Adaptive Process Control (APC), and Auto Board Support Pin
Industry's first 3D Multi Recognition Camera
Lightweight 16-nozzle head (for 84,000 CPH)
Increased placement accuracy to 25um (cpk ≥1.0)
Model ID | ||||||||||||||||
Rear head Front head | Lightweight | 12-nozzle head | 8-nozzle head | 2-nozzle head | Dispensing head | No head | ||||||||||
Lightweight 16-nozzle head | NM-EJM6D | NM-EJM6D-MD | NM-EJM6D | |||||||||||||
12-nozzle head | ||||||||||||||||
8-nozzle head | ||||||||||||||||
2-nozzle head | ||||||||||||||||
Dispensing head | NM-EJM6D-MD | - | NM-EJM6D-D | |||||||||||||
Inspection head | NM-EJM6D-MA | NM-EJM6D-A | ||||||||||||||
No head | NM-EJM6D | NM-EJM6D-D | - | |||||||||||||
PCB | Dual-lane | L 50 x W 50 ~ L 510 x W 300 | ||||||||||||||
Single-lane | L 50 x W 50 ~ L 510 x W 590 | |||||||||||||||
PCB | Dual-lane | 0 s* *No 0s when cycle time is 3.6 s or less | ||||||||||||||
Single-lane | 3.6 s* *When selecting short conveyors | |||||||||||||||
Electric source | 3-phase AC 200, 220, 380, 400, 420, 480 V 2.7 kVA | |||||||||||||||
Pneumatic source *2 | 0.5 MPa, 100 L /min (A.N.R.) | |||||||||||||||
Dimensions *2 (mm) | W 832 x D 2 652 *3 x H 1 444 *4 | |||||||||||||||
Mass | 1 680 kg (Only for main body:This differs depending on the option configuration.) | |||||||||||||||
Placement head | Lightweight 16-nozzle head | 12-nozzle head | 8-nozzle head | 2-nozzle head | ||||||||||||
High production mode [ON] | High production mode [OFF] | |||||||||||||||
Max. speed | 42 000 cph | 38 000 cph | 34 500 cph | 21 500 cph | 5 500 cph | |||||||||||
Placement accuracy | ± 40 µm/chip | ±30 μm / chip | ±30 μm / chip | ± 30 µm/chip 12mm to 32mm ± 50 µm/QFP 12mm Under | ± 30 µm/QFP | |||||||||||
Component | 0402 chip*6 to L 6 x W 6 x T 3 | 03015*6*7/0402 chip*6 to L 6 x W 6 x T 3 | 0402 chip*6 to L 12 x W 12 x T 6.5 | 0402 chip*6 to L 32 x W 32 x T 12 | 0603 chip to L 100 x W 90 x T 28 | |||||||||||
Component | Taping | Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm | Tape : 4 to 56 / 72 / 88 / 104 mm | |||||||||||||
Max. 68 (4, 8 mm tape, Small reel) | ||||||||||||||||
Stick | - | Max.16 (Single stick feeder) | ||||||||||||||
Tray | - | Max.20 (per tray feeder) | ||||||||||||||
Dispensing head | Dot dispensing | Draw dispensing | ||||||||||||||
Dispensing speed | 0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation) | 4.25 s/component (Condition: 30 mm x 30 mm corner dispensing)*8 | ||||||||||||||
Adhesive position accuracy | ± 75 μ m /dot | ± 100 μ m /component | ||||||||||||||
Applicable components | 1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP | SOP,PLCC,QFP, Connector, BGA, CSP | ||||||||||||||
Inspection head | 2D inspection head (A) | 2D inspection head (B) | ||||||||||||||
Resolution | 18 µm | 9 µm | ||||||||||||||
View size (mm) | 44.4 x 37.2 | 21.1 x 17.6 | ||||||||||||||
Inspection position accuracy *12 | ± 20 μm | ± 10 μm | ||||||||||||||
No. of | Solder | Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine) | ||||||||||||||
Component | Max. 10 000 pcs./machine |
*1 : Due to a difference in PCB transfer reference, a direct connection with NPM (NM-EJM9B) / NPM-W (NM-EJM2D) /NPM-W2 (NM-EJM7D) dual lane specs cannot be established.
*2 : Only for main body
*3 : Dimension D including tray feeder : 2 683 mm
Dimension D including feeder cart : 2 728 mm
*4 : Excluding the monitor, signal tower and ceiling fan cover.
*5 : ±25 μm placement support option.(Under conditions specified by Panasonic)
*6 : The 03015/0402 mm chip requires a specific nozzle/feeder.
*7 : Support for 03015 mm chip placement is optional.(Under conditions specified by Panasonic:Placement accuracy ±30 μm / chip )
*8 : A PCB height measurement time of 0.5s is included.
*9 : One head cannot handle solder inspection and component inspection at the same time.
*10 : Please refer to the specification booklet for details.
*11 : Foreign object is available to chip components. (Excluding 03015 mm chip)
*12 : This is the solder inspection position accuracy measured by our reference using our glass PCB for plane calibration. It may be affected by sudden change of ambient temperature.
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Contact: Tommy
Phone: +86 13691605420
E-mail: tommy@flason-smt.com
Add: No.94,Guangtian Road,Songgang Street,Bao an District Shenzhen China